TSV-based 3D IC Research Activities at the Georgia
Tech Computer-AidedDesign (GTCAD) Laboratory
Abstract
This talk provides an overview of various 3D IC research projects being
conducted at the Georgia Tech Computer-Aided Design (GTCAD) laboratory in
two parts. First, we present our 3D-MAPS (massively parallel processor with
stacked memory) processor, arguably the first many-core 3D processor from
academia. This 3D IC is taped out in March 2010 and will be fabricated by
August 2010. We discuss the architecture, TSV-based chip-to-chip communication
methodology, 3D computer-aided design (CAD) tool-flow, packaging, and testing
mechanism. Second, we present various ongoing research projects that encompass
design-for-manufacturability (DFM), design-for-testing (DFT), advanced cooling
with microfluidic channels, TSV management during circuit and physical design,
and heterogeneous integration issues for TSV-based 3D ICs. Our sponsors include
the National Science Foundation (NSF), Semiconductor Research Corporation (SRC)
, US Department of Defense (DOD), Intel, and IBM.
About Sung Kyu Lim
Sung Kyu Lim received the B.S., M.S., and Ph.D. degrees from the Computer
Science Department, University of California, Los Angeles (UCLA), in 1994, 1997
, and 2000,respectively. He joined the School of Electrical and Computer
Engineering, Georgia Institute of Technology in 2001, where he is currently an
Associate Professor. His research focus is on the modeling, circuit design, and
computer aided design for through-silicon-via-based 3D integrated circuits.
Dr. Lim received the National Science Foundation Faculty Early Career
Development (CAREER) Award in 2006. He served as an Associate Editor of the
IEEE Transactions on Very Large Scale Integration Systems during 2007-9. He is
the author of "Practical Problems in VLSI Physical Design Automation"
(Springer, 2008).
Time: 3:30pm-6:00pm, June 11, 2010 (Friday)
Place: Room ED528, Dept. of Electronics
National Chiao Tung University
Home page: http://users.ece.gatech.edu/~limsk
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