Call for Papers
IEEE Signal Processing Society
IEEE Journal of Selected Topics in Signal Processing (J-STSP)
Special Issue on DSP Techniques for RF/Analog Circuit Impairments
Recent advances in digital processing capabilities and VLSI technology
scaling, fueled by Moore’s law, have widened the gap between digital
and analog circuits in terms of their performance/complexity/cost
tradeoffs. This trend is projected to become even more significant in
the future. Radio Frequency (RF) impairments in analog circuits are
mainly due to fabrication process variations which are difficult to
predict or control, increase with fabrication technology down scaling,
and can severely limit the achievable performance. In addition,
System-on-Chip (SoC) orientation brings increased levels of
integration putting RF and digital signal processing not only in the
same package but integrating them on the same die. These
considerations have spurred recent research activities in the signal
processing and circuits technical communities on effective digital
baseband compensation techniques for “dirty” RF/analog circuits.
The objective of this inter-disciplinary special issue is to highlight
the important role of digital signal processing techniques in
understanding and mitigating RF/analog circuit impairments.
Original papers, previously unpublished and not currently under review
by another journal, are solicited for this special issue. Topics of
interest include, but are not limited to :
- Non-linearity and power efficiency issues in transmit high-power
amplifiers (HPA) and receive low-noise amplifiers (LNA)
- In-phase/Quadrature (I/Q) imbalance and non-linearity issues in mixers
- Phase noise and frequency offset issues in oscillators
- Precision, sampling rate, dynamic range, non-linearity issues in
Analog-to-Digital (A/D) and Digital-to-Analog (D/A) converters
- DC offset compensation in communication receivers
- Digital post- and pre-compensation of analog front-end
characteristics, including frequency-dependent I/Q mismatch
- Digital compensation for process- and temperature-based variations
of front-end characteristics
- Applications to OFDM and MIMO systems
- Applications to UWB,WLAN, WiMAX, LTE, Cognitive Radio, and military
communications
Submission information is available at http://www.ece.byu.edu/jstsp .
Authors are required to follow manuscript submission guidelines to the
IEEE Transactions on Signal Processing (T-SP) at
http://ewh.ieee.org/soc/sps/tsp/ . Submitted manuscripts will be peer
reviewed according to the standard IEEE process.
Submission deadline : June 1, 2008
First round of reviews completed : September 15, 2008
Revised manuscripts due : November 1, 2009
Second round of reviews completed : January 1, 2009
Final manuscripts due : February 1, 2009
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