報告要用...
因為後天要出遠門(15日),沒時間去找資料了...
拜託知道的幫我回答一些吧...
有點實務的題目,我也不知道是不是要問電機的,
希望知道的幫一下囉^^|
1.Explain what "stacked-die packaging" is in the packaging industry.
What are the advantages and challenges for "stacked-die" packaging.
2.How is the flip chip different from traditional ICs? Explain the
advantages and limitation of flip technology.
3.Compare the different photo-imaging approaches used in inner and
outer layer patterning of a PCB. Why are they different?
4.Compare the photo imaging processes used in the I.C. fabrication
and the PCB manufacturing processes in terms of: Purposes, materials
type, cost level, precision level.
5.Explain the following terms including its usage:
1)Prepreq
2)CCL
3)Via(compare thru/blind/buried vias)
4)Burr
5)Solder mask
6.Discuss factors that affect the quality of solder printing
7.Explain the following defect types in board assembly.Give possible
reasons for each defect type.
1)Tombstone
2)Voids
3)Wicking
4)Icicle
5)dissolution of metalization
6)lean solder fillet
7)non-wetting
8)webbing
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