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課程名稱︰晶片系統封裝
課程性質︰選修
課程教師︰盧信嘉
開課學院：電信所
開課系所︰電信所
考試日期（年月日）︰2008/04/15
考試時限（分鐘）：180 min
是否需發放獎勵金：是
（如未明確表示，則不予發放）
試題 :
1.(10pts)Please design a 5-kΩ meandered resistor made from a material having
a resistivity of 420μΩ-cm using that 600Å thick and 6 mil wide. Make the
spacing of the meanders equal to the width and make the entire footprint as
close to a square as possible.
2.(10pts)For the impedance of a capacitor shown in Fig.9.29, please find the
values of CRL in its equivalent midel.
3.(25pts)A transmitter with source impedance of 30Ω is connected with a 75Ω
load by a 50Ω microstrip on alumina substrate. The interconnect is similar
to fig 6.42. The dielectric constan of alumina is 9.8, with thickness of 1mm.
The width of 50Ω microstrip is also 1mm. The length of microstripline is
1cm. Please find:
a.The voltage reflection coefficient at source and load.
b.The time of flight T.
c.Draw the reflection diagram for 4T. Label all quantities at each time
interval.
d.Draw the time domain waveform for the midpoint of microstrip line between
0 and 4T.
4.(10pts)A 1㎝^2 oxidised copper plate is kept at 0℃ and a 1㎡ oxidised copper
plate is kept at 100℃. They are parallel to each other and the distance
between these two plate is 20cm. The radiation from the small plate is
complete incident on the large plate. Please find the net heat exchange rate
between the two plates.
5.(15pts)The vias in LTCC is filled with metal, while the vias in FR4 are not
completely filled with metal. Please compare the electrical resistance and
thermal resistance of a via with 100um diameter and 200um height in LTCC and
FR4. You can assume the via in FR4 uses Cu with thickness of 10um. The via in
LTCC use silver palladium.
6.(10pts)Please compare the total inductance of the following two possible
wiring methods:
a.Two parallel lines with 1mm spacing, 1mm in diameter and 10cm long.
b.Two parallel plate with 1mm spacing and 10cm*10cm in size.
7.(10pts)Fig. 10.15 of Integrated Inductors shows that the increasing in the
thickness of Cu inductor trace can improve Q_L. Please explain why the
improvement of Q_L is not significant when the thickness is over 10um.
8.(10pts)Based on the via formation processgiven in Chap4, is it possible to
make blind or buried vias? If it is possible, please briefly give the
procedures.If it is not possible,please give the reason.
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