作者jacklu2816 ()
看板Tech_Job
標題[情報] 英特爾大連招研發工程師
時間Tue Aug 28 11:45:46 2018
Intel is Hiring Technology Development Engineer in Dalian, China
We are looking for engineers at ALL levels that are excited to be part of one
of Intel's fast growing business unit, NSG Non-Volatile Memory Solutions Group
. Leveraging success of 3D NAND high volume manufacturing facility, we are ram
ping up Dalian Technology Development (TD) organization. Join us and help us c
reate the next generation memory technology that serves world’s explosive gro
wth of data storage needs and challenges.
We have several positions in process and process integration areas:
Position 1- Intel Technology Development Process Engineer
This job requisition is look for multiple candidates for the positions of Proc
ess Engineer, with work location in Dalian, China, reporting to TD Module Engi
neering Managers. The selected candidates will be responsible for activities
covering process, equipment, materials, and operations in their respective are
as of expertise, such as CVD/PVD/CMP/Diffusion/Implant/Metro/Lithography/Wet E
tch/Dry Etch.
Examples of scope of work include silicon process improvement and product enha
ncement, equipment capability evaluation and expansion, and wafer cost reducti
on.
Candidates must have demonstrated a track record of excellence in creative pro
blem solving, equipment capability enabling, or manufacturing process optimiza
tion in a relevant engineering organization.
Responsibilities include:
‧ Perform feasibility study and provide module level process solutions
to meet desired device specification and process improvement requirements
‧ Lead new process experimentation, implementation and high volume manu
facturing readiness in the area of expertise
‧ Define, select and qualify the equipment platforms to meet quality an
d output needs of new processes for high volume manufacturing ramp.
Position 2- Intel Technology Development Yield and Integration Engineer
This job requisition is look for multiple candidates for the positions of Yiel
d Engineer, FA Engineer, Defect Reduction Engineer, Integration Engineer, Devi
ce Engineer, Quality and Relibility Engineer, and Test Engineer, reporting to
TD Integration or Device Engineering Managers.
Examples of scope of work include silicon process improvement and product enha
ncement, device capability evaluation and expansion, and wafer cost reduction.
Candidates must have demonstrated a track record of excellence in creative pro
blem solving, device or test capability enabling, or manufacturing process opt
imization in a relevant engineering organization.
Responsibilities include:
‧ Perform feasibility study and provide integrated process solutions to
meet desired device specification and process improvement requirements
‧ Lead new device experimentation, implementation and high volume manuf
acturing readiness in the area of expertise
‧ Define, explore and qualify new integrated process solutions to meet
quality and output needs of new processes for high volume manufacturing ramp.
Qualifications
-- PhD in a science or engineering field and with graduation date in 2018 or e
arly 2019
-- Direct experience in semiconductor research/fabrication environment is high
ly desired
-- Demonstrated technical leadership and a track record of problem solving wit
h creativity and out-of-box thinking
-- Strong expertise of process characterization, qualification and troubleshoo
ting is required;
Other Qualifications
--Motivated self-starter, with strong ability to work independently as well as
in a team environment;
--Strong verbal and written communication skills in English;
--Think and operate independently, while simultaneously focusing on many diver
se priorities.
--Flexibility and maturity in facing uncertainties and changing priorities/res
ponsibilities
--Commit to aggressive goals and win with a can-do attitude
--Act with velocity and a strong sense of urgency
--Respect cultural diversity and sensitivity
--Agility in learning, improving, and innovating
How to apply: pls send your resume to
[email protected] , feel free to co
ntact this email if you have any question.
Learn more about Intel DMTM
https://jobs.intel.com/page/show/nsg-dalian-fab-chinese
--
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※ 文章網址: https://www.ptt.cc/bbs/Tech_Job/M.1535427950.A.A60.html
→ becalm: 薪資? 08/28 11:53
→ jeromeshih: 想去的可能先看看這篇相關的討論再決定 08/28 12:03
噓 wolfwolf: Compensation? 看不懂中文板規嗎 08/28 12:10
→ wondtty: how much ? 08/28 12:31
噓 sean2449: 掰 08/28 12:33
推 rainbowcatch: 有趣的事在大陸設廠然後台灣招募人才 台勞便宜好 08/28 12:52
→ rainbowcatch: 用 全世界都知 08/28 12:52
→ driver0811: 不怕技術被偷? 08/28 13:00
推 craps: intel偷台灣技術? 08/28 13:02
推 bearalex: 根據他之前的文章 新鮮人50萬台幣起薪 就不要浪費時間了 08/28 13:24
推 Morphee: 台灣人就是低等 低薪又奴又不會談判 08/28 13:24
→ GTX9487: 樓樓上應該是指intel技術被 ... 偷走 08/28 13:24
→ leavefly: 一種高人一等來選妃的心態 08/28 13:26
推 Raikknen: for 10nm? 08/28 13:32
噓 JasonIm: 這哪家,有比台積強嗎? 08/28 14:11
→ pnsboy: 朋友的朋友有去 簽兩年大概170萬台幣 稅前 08/28 15:09
→ Yankees: 2年170萬台幣 所以平均一年才85萬?? 08/28 15:35
推 ggggggh: 一年一百七 扣完稅 也剩不多了...... 08/28 15:45
推 jeromeshih: 太低的薪水不會因為po 多次就能招到人吧,還是打算用 08/28 15:48
→ jeromeshih: 名氣來招人 08/28 15:48
→ coletrain: Intel是哪家公司 沒聽過 08/28 15:59
→ pnsboy: 是ㄧ年170 兩年170也沒必要去東北 08/28 16:02
推 ggggggh: ㄧ百七要看扣多少稅。 我發現不如台中美光... 08/28 16:36
噓 wavier: 薪水? 08/28 19:13
推 welcomeboy: 170 是白痴的意思? 08/28 19:31
推 youkiller: 有遇過一個跑去的工程師,談到大約1.4倍台積薪資 08/28 20:37
推 mmnnoo: 大陸稅重啊… 08/29 01:09
推 yangpuhols: 有興趣可以站內我 剛來這邊三個月了 09/03 17:32